Titanium Nitride Thin Films by the Electron Shower Process

Titanium nitride (TiN), a stable compound with the NaCl structure, has a wide range of properties which find applications in cutting tools, wear resistant parts, semiconductor metallization, and the jewelry industry. However, there are problems with preparing highly adhesive thin films which maintain good properties. Thin films of titanium nitride have been prepared by the Electron Shower (ES) and Enhanced Activated Reactive Evaporation (EARE) processes. These films exhibit extremely high adhesion to glass and other substrates, and good optical and electronic properties. Several analytical techniques such as X-ray diffraction (XRD), resistivity vs. temperature, Atomic Force Microscopy (AFM), and UV-Visible-NIR spectroscopy, were utilized to characterize the films. AFM images indicate a fine-grained columnar microstructure, with 20-150nm grain size. Resistivities -200-Q.cm at room temperature were obtained, generally decreasing as temperature decreases. Infrared reflection of up to 70% was obtained, with good wavelength selectivity. These properties are nearly as good as the best values reported in the literature. Finally, it is shown that the ES/EARE processes can produce high quality TiN films with good adhesion. Thesis Supervisor: Jagadeesh S. Moodera Title: Research Scientist, Francis Bitter Magnet Laboratory Thesis Supervisor: Caroline A. Ross Title: Associate Professor of Materials Science and Engineering _ C~1 ~ ~ ~ ~ C